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The Xilinx Spartan 3E FPGA is available in different configurations depending on the power, memory, and I/O requirements.
Packaging forms
The Spartan 3E comes in different packagings such as BGA, TQFP, and PQFP, which allows the ICs to be mounted onto rapidly evolving or flexible printed circuit boards depending on the end usage of the devices. The FPGA packaging also affects the number of external channels and connections available, impacting the design of the system board.
Spartan 3E 2400
The Xilinx Spartan 3E FPGA, being a powerful model, offers up to 2.4 million logic gates, 1.1 Mbits of block DRAM memory, and 1.700 configurable I/Os for complex designs. This model is suitable for demanding applications requiring high capacity in the case of users.
Spartan 3E 1600
The Xilinx Spartan 3E-1600 FPGA is a medium-density field-programmable gate array, which is optimized for cost and performance. This model provides about 1.6 million logic channels and 1 Mbit embedded memory. Its specifications make it suitable for general usage in telecommunications, which require moderate complexity.
Spartan 3E 1200
The 1200 model offers approximately 1.2 million logic channels and 900 kbits of block memory. It is a good model for cost-sensitive applications, which may include video and audio processing.
Communication systems
The Xilinx Spartan 3E field-programmable gate array is flexible and well-suited for handling communication protocols, signal processing, and data routing in next generations of telecommunications infrastructure, such as mobile networks, optical fibers, and satellite communications. Due to its high processing speed and configurability, it supports real-time data transfer and enhances the overall network's capacity and reliability.
Embedded systems
In embedded systems design, the Spartan 3E FPGA enables the implementation of customized control logic and interfaces, especially in applications where the hardware needs to be adapted to specific tasks like industrial automation, consumer electronics, and automotive systems. With its capability to handle multiple tasks concurrently, it offers increased efficiency and supports complex operations in real-time.
Video and image processing
The Xilinx Spartan 3E FPGA's parallel processing capabilities make it ideal for real-time video and image processing tasks, which include encoding, decoding, and applying filters in security cameras, broadcast systems, and medical imaging devices. This device is especially useful in applications that require high-speed data processing with low latency.
Test and measurement equipment
The versatility of the Xilinx Spartan 3E FPGA enables the design of customized test algorithms and data acquisition interfaces in instruments used for testing and measurement. It supports the rapid processing and analysis of signals and data in engineering tools, QA systems for electronics, and telecommunications checks, which gives accurate results and improves device testing efficiency.
Aerospace and defense systems
In aerospace and defense applications, the reconfigurability of the Spartan 3E FPGA allows it to adapt to new algorithms and standards quickly, making it suitable for radar, signal intelligence, and navigation systems. Its reliability in critical environments enables long-term operation with enhanced security and real-time situational awareness in defense and military operations.
Choosing the right FPGA for an industrial application involves several considerations.
Logic density
Logic density is one of the main factors to consider when selecting an FPGA for a given application. The logic density determines how complex a design can be. For example, large systems require greater logic densities, while simpler tasks can be supported by lower logic densities.
Embedded memory
Embedded memory is another key factor when selecting an FPGA. Applications with high data requirements such as digital signal processing require FPGAs with large amounts of embedded memory. On the other hand, applications that need little or no data do not require FPGAs with high embedded memory.
Speed grades
Speed grades define the working speed of various FPGAs. High-speed grades are ideal for applications that require real-time performance. Low-speed grades are best suited for non-time-critical applications.
Power consumption
For applications where the power budget is a constraint, an inexpensive FPGA with low power consumption should be selected. Conversely, power-hungry applications can afford FPGAs with high power consumption.
I/O count and standards
I/O count and standards selection is based on the requirements of the specific interface. The Spartan 3E is available in different I/O configurations. The selection of the I/O interface should also depend on the project data transfer speed.
Development tools and community support
The availability of development tools and community support is very essential, especially for first-time users. Developing complex designs will also require more sophisticated design tools and user support.
FPGA development boards
FPGA development boards are used to provide a practical platform for users to develop and test their designs. Common boards utilized with the Spartan 3E FPFA include the Xilinx Spartan 3E starter kit and the Digilent Nexys 2. These boards gave users direct access to the FPGA's pins and resources, simplifying the process of design validation.
Flash memory
Flash memories are used to store FPGA configuration data and application codes. Often integrated into larger systems, they provide rapid access to critical data. Common options include NAND and NOR flash memory.
Embedded systems
Embedded systems like industrial machines and RF signals utilise FPGAs to give flexibility for hardware logic customisation. The Xilinx Spartan 3E is especially popular in embedded applications because of its cost-effectiveness and efficiency. They are commonly integrated into embedded systems for signal processing and data management.
Microcontrollers
Microcontrollers are the most basic programmable integrated circuits. Merging a microcontroller with an FPGA creates a hybrid system that leverages the strengths of both components. This combination ensures efficient processing while allowing for extensive parallel tasks. This combination is useful for real-time control.
Power management ICs
Power management ICs are particularly important for the efficient operation of the Spartan 3E, as they will need to manage several power supplies and voltage levels to ensure that the FPGA operates within required specifications. Common PMICs include voltage regulators and DC-DC converters.
A1: The Xilinx Spartan 3E FPGAs are good for delivering a balance of performance, power efficiency, and design flexibility. These features make them suitable for a broad spectrum of applications, such as embedded systems, telecommunications, industrial automation, and video processing, which require efficient data handling and real-time processing.
A2: The Xilinx Spartans are designed to be effective and efficient in telecommunications applications. Their logic density, on one hand, permits the implementation of complex communication protocols and signal processing as well as enhanced data routing, a feat made possible by their configuration capabilities. Additionally, they support high-speed data transfer.
A3: The Xilinx Spartans are utilized in multiple industrial scenarios owing to their flexibility and ability to handle various complex tasks. For example, powerhouse elements are used in telecommunications infrastructures, embedded systems, video and image processing, test and measurement equipment, and aerospace and defense systems.
A4: Key specifications such as logic density, speed, large amounts of block RAM, and high-configurable I/O counts, among others, enable the Xilinx Spartans to perform well. The efficient design of these integrated circuits permits the handling of diverse complex tasks, a feature that comes in handy in various industrial applications.
A5: The key features of the Xilinx Spartan 3E, such as a fabrication process of only 90 nm, a logic cell count of about 200k, a maximum clock speed of 300 MHz, and 1 Mbyte of block RAM, enable efficient management of various tasks. These features allow the ICs to be used in diverse applications where low latency is critical.