Semiconductor Equipment SOT TO220 TO252 TO247 Soft Solder Die Bonder Eutectic Die Bonder for IC to Package

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Guangzhou Minder-Hightech Co., Ltd.

Multispecialty supplier10 yrs

CN

Semiconductor Equipment SOT TO220 TO252 TO247 Soft Solder Die Bonder Eutectic Die Bonder for IC to Package

Semiconductor Equipment SOT TO220 TO252 TO247 Soft Solder Die Bonder Eutectic Die Bonder for IC to Package

Semiconductor Equipment SOT TO220 TO252 TO247 Soft Solder Die Bonder Eutectic Die Bonder for IC to Package

Semiconductor Equipment SOT TO220 TO252 TO247 Soft Solder Die Bonder Eutectic Die Bonder for IC to Package

Semiconductor Equipment SOT TO220 TO252 TO247 Soft Solder Die Bonder Eutectic Die Bonder for IC to Package

Service

Free replacement parts

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Key attributes

Industry-specific attributes

brand name

minder-hightech

Other attributes

weight (kg)

2200

warranty

1 Year

video outgoing-inspection

Provided

machinery test report

Provided

core components

PLC

place of origin

Guangdong, China

Packaging and delivery

Selling units

Single item

Single package size

200X200X160 cm

Single gross weight

2000.000 kg

Lead time

Customization options

Product descriptions from the supplier

Customizable

>= 1 sets

$200,000

Quantity

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

Item subtotal (0 variations 0 items)

$0.00

Shipping total

To be negotiated

Subtotal

$0.00

4 interest-free payments with

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